Journal Guide

Please be advised that the Aims and Scope for the journal has recently been updated. The journal will no longer consider or publish papers on concrete and cement-based systems nor on polymeric and polymer-based materials.Materials Science and Engineering A provides an international medium for the publication of theoretical and experimental studies related to the load-bearing capacity of materials as influenced by their basic properties, processing history, microstructure and operating environment. Appropriate submissions to Materials Science and Engineering A should include scientific and/or engineering factors which affect the microstructure - strength relationships of materials and report the changes to mechanical behavior. The journal does not seek or publish papers on concrete and cement-based systems nor on polymeric and polymer-based materials.Benefits to authorsWe also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our support pages: http://support.elsevier.com

The journal provides an international medium for the publication of theoretical and experimental studies and reviews related to the electronic, electrochemical, ionic, magnetic, optical, and biosensingproperties of solid state materials in bulk, thin film and particulate forms. Papers dealing with synthesis, processing, characterization, structure, physical properties and computational aspects of nano-crystalline, crystalline, amorphous and glassy forms of ceramics, semiconductors, layered insertion compounds, low-dimensional compounds and systems, fast-ion conductors, polymers and dielectrics are viewed as suitable for publication. Articles focused on nano-structured aspects of these advanced solid-state materials will also be considered suitable.Benefits to authorsWe also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our support pages: http://support.elsevier.com

Materials Science and Engineering C: Materials for Biological Applications includes topics at the interface of the biomedical sciences and materials engineering. These topics include:• Bioinspired and biomimetic materials for medical applications• Materials of biological origin for medical applications• Materials for "active" medical applications• Self-assembling and self-healing materials for medical applications• "Smart" (i.e., stimulus-response) materials for medical applications• Ceramic, metallic, polymeric, and composite materials for medical applications• Materials for in vivo sensing• Materials for in vivo imaging• Materials for delivery of pharmacologic agents and vaccines• Novel approaches for characterizing and modeling materials for medical applicationsBenefits to authorsWe also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our support pages: http://support.elsevier.com

Materials Science & Engineering R: Reports publishes invited review papers covering the full spectrum of materials science and engineering. The reviews, both experimental and theoretical, provide general background information as well as a critical assessment on topics in a state of flux. The editorial policy of Materials Science & Engineering R: Reports is to serve its readership in two ways. Firstly, it provides a critical overview of the current issues in a well-defined area of immediate interest to materials scientists. Secondly, each review contains an extensive list of references thus providing an invaluable pointer to the primary research literature available on the topic. This policy is implemented by the Editorial Board which consists of outstanding scientists in their respective disciplines. The Board identifies the topics of interest and subsequently invites qualified authors. In order to ensure speedy publication, each review is published separately.Benefits to authorsWe also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our support pages: http://support.elsevier.com

MORE (Maney Online Research E-journal) Collections represent real value for money.The licensing options have been designed to suit the differing needs of academic institutions worldwide. They aim to reduce the unit cost of information whilst at the same time expand access to a wider range of electronic content.Licensing the Full Collection of electronic journals represents the best value of money for multidisciplinary universities wishing to provide the greatest breadth of content to their users. We also deliver subject-specific and tailor-made packages. See the right-hand links for more information.

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

Materials Today is the gateway to materials science and home to the leading Open Access Journal. Visit www.materialstoday.com for access to the journal and much more.

Materials and Manufacturing Processes deals with issues that result in better utilization of raw materials and energy, integration of design and manufacturing activities requiring the invention of suitable new manufacturing processes and techniques, unmanned production dependent on efficient and reliable control of various processes including intelligent processing, introduction of new materials in industrial production necessitating new manufacturing process technology, and more. Information is offered in various formats, including research articles, letter reports, review articles, conference papers, applied research, book and conference reviews, patent reports, and entire issues devoted to symposia. Publication office: Taylor & Francis, Inc., 325 Chestnut Street, Suite 800, Philadelphia, PA 19106.

Materials at High Temperatures publishes peer reviewed contributions relating to high temperature applications in the power, chemical, engine, processing and furnace industries.

Meccanica focuses on the methodological framework shared by mechanical scientists when addressing theoretical or applied problems. Original papers address various aspects of mechanical and mathematical modeling, of solution, as well as of analysis of system behavior. The journal explores fundamental and applications issues in established areas of mechanics research as well as in emerging fields; contemporary research on general mechanics, solid and structural mechanics, fluid mechanics, and mechanics of machines; interdisciplinary fields between mechanics and other mathematical and engineering sciences; interaction of mechanics with dynamical systems, advanced materials, control and computation; electromechanics; biomechanics.Articles include full length papers; topical overviews; brief notes; discussions and comments on published papers; book reviews; and an international calendar of conferences. Meccanica, the official journal of the Italian Association of Theoretical and Applied Mechanics, was established

Ongoing developments in mechanical, aeronautical and civil engineering and major changes brought about by advances in instrumentation and associated computing power necessitate the application and integration of techniques involving systems theory, signal processing, control theory and statistics. Mechanical Systems and Signal Processing (MSSP) provides a forum for the discussion of research covering these disciplines with an emphasis not only on fundamental theoretical advances but also balancing theoretical and experimental demonstration of new methodologies and techniques.MSSP publishes refereed papers of the highest quality reflecting the activities and interests of workers in academic and industrial research and development establishments. Especially sought are papers that include both theoretical and experimental aspects, or that include theoretical material of high relevance to practical applications. Papers showing mainly applications of established approaches will rarely be considered.It is a leader in its field, and the research areas covered include:• Diagnostics of mechanical systems/machines/components• Diagnostics/prognostics/machine learning• Structural dynamics, modal analysis (theoretical and experimental)• Structural health• Sensing/measurements/data acquisition• Signal processing: advances relevant to mechanical systems• System modeling and identification• Uncertainty and robust reliability of mechanical systems• Vibration monitoring and control• Rotor dynamics, rotating machinery• Noise source location and noise cancellation• Dynamic loading and force identification• Inverse problems• Machine and material dynamics, meta materials• Vibro-acoustic modeling, simulation, testing and validation• Automotive research.

With papers from industry, Research and Development departments and academic institutions, this journal acts as an interface between research and industry, coordinating and disseminating scientific and technical mechanical research in relation to industrial activities.

Other technical areas of interest include high-speed computing, numerical methods, structural optimization, variational methods, stability, fatigue and fracture mechanics, plasticity, and related basic applied mechanics and mechanics-based design. Publication office: Taylor & Francis, Inc., 325 Chestnut Street, Suite 800, Philadelphia, PA 19106.

Mechanics Research Communications publishes as rapidly as possible manuscripts of high standards but restricted length. It aims at providing a fast means of communication and of exchange of ideas among workers in Mechanics, at offering an effective method of bringing new results quickly to the public and at establishing an informal vehicle for the discussion of ideas that may still be in the formative stages.Mechanics Research Communications will publish both scientific and applied contributions. In either category, papers may be one of three types:1. Complete: Self-contained, normally no more than about twelve manuscript pages long. The essence and motivation of the communication must be made clear in a first section, called Introduction, of length appropriate to that of the entire article and written so as to be understandable to the majority of workers in Mechanics. No further abstract is required. The remainder of the contribution may, of course, be addressed to specialists.2. Work in Progress and Preliminary Results: Accounts of current research and of tentative results even if of a conjectural but well documented nature, about three or four manuscript pages in length.3. Letters: Not over two manuscript pages long usually dealing with previously printed contributions or with matters of general interest to the Mechanics community, to be written in non-aggressive language. After acceptance of letters referring to previous communications, the authors of the original articles will be informed and allowed four weeks time to submit a written reply. The letter and the reply will be printed simultaneously.In addition, special features may be added from time to time.The field of Mechanics will be understood in a broad sense, no attempt being made to limit it or to provide it with a precise definition. It will encompass the behavior of fluids, solids, particles, continua, rigid bodies, mechanisms, systems and so forth. It will include theoretical as well as applied and experimental researches, whether aimed at fundamental scientific advances or at practical engineering results.

The central aim of Mechanics of Advanced Materials and Structures is to promote the dissemination of significant developments and publish state-of-the-art reviews and technical discussions of previously published papers dealing with mechanics aspects of advanced materials and structures. Refereed contributions describing analytical, numerical and experimental methods and hybrid approaches that combine theoretical and experimental techniques in the study of advanced materials and structures will be published along with critical surveys of the literature and discussions of papers in the field. Contributions will range from new theories and formulations to analyses and novel applications. Emphasis will be placed on mechanics aspects and aspects at the interface of materials and mechanics issues. The journal will publish manuscripts dealing with the mechanics aspects (for example, the mechanical characterization, mathematical modeling, novel applications, and numerical simulation) of advanced materials and structures. Contributions may range from new methods to novel applications of existing methods to gain understanding of the material and/or structural behavior of new and advanced. Typical topic areas are: * Materials: Adhesives, ceramics, metal-matrix composites, and polymer-based composites; processing and manufacturing of composite; actuator/sensor (smart) materials and electromagnetic materials; and damage and failure mechanisms in material. * Structures: Basic structural elements such as beams, plates, and shells; structures with actuators/sensors (smart structures); active and passive control of structures; aerospace, automotive, and underwater structures; and adhesively bonded structures. * Methodologies: Mathematical formulation of the kinematic, constitutive, and structural behavior of materials and structures; experimental methods directed toward mechanical characterization, damage evolution, and failures in materials and structures; computational methods for the solution of micro-, meso-, macro-mechanics mathematical models; methods dealing with the determination of local effects; and novel computational approaches for material and structural modeling of new and advanced materials. Publication office: Taylor & Francis, Inc., 325 Chestnut Street, Suite 800, Philadelphia, PA 19106.

Mechanics of Time-Dependent Materials promotes the transfer of knowledge between various disciplines that deal with the properties of time-dependent solid materials but approach these from different angles. Among these disciplines are: Mechanical Engineering, Aerospace Engineering, Chemical Engineering, Rheology, Materials Science, Polymer Physics, Design, and others. The journal deals with the time-dependent mechanical properties of solid polymers, metals, ceramics, concrete, wood, or their composites. It is recognized that certain materials can be in the melt state as function of temperature and/or pressure. Contributions address fundamental issues relating to processing and melt-to-solid transition behavior as well as time-dependent failure and fracture phenomena.